JPS6368506U - - Google Patents
Info
- Publication number
- JPS6368506U JPS6368506U JP16230086U JP16230086U JPS6368506U JP S6368506 U JPS6368506 U JP S6368506U JP 16230086 U JP16230086 U JP 16230086U JP 16230086 U JP16230086 U JP 16230086U JP S6368506 U JPS6368506 U JP S6368506U
- Authority
- JP
- Japan
- Prior art keywords
- flange
- legs
- pair
- twisting force
- clip portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Insertion Pins And Rivets (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16230086U JPH0322569Y2 (en]) | 1986-10-24 | 1986-10-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16230086U JPH0322569Y2 (en]) | 1986-10-24 | 1986-10-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6368506U true JPS6368506U (en]) | 1988-05-09 |
JPH0322569Y2 JPH0322569Y2 (en]) | 1991-05-16 |
Family
ID=31089432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16230086U Expired JPH0322569Y2 (en]) | 1986-10-24 | 1986-10-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0322569Y2 (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002039133A (ja) * | 2000-07-24 | 2002-02-06 | Toyo Kasei Kk | 取付部材の着脱装置 |
JP2008032205A (ja) * | 2006-07-05 | 2008-02-14 | Piolax Inc | クリップ |
WO2012023306A1 (ja) * | 2010-08-16 | 2012-02-23 | 株式会社屋根技術研究所 | 板状モジュールの固定構造 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
US7211508B2 (en) | 2003-06-18 | 2007-05-01 | Applied Materials, Inc. | Atomic layer deposition of tantalum based barrier materials |
-
1986
- 1986-10-24 JP JP16230086U patent/JPH0322569Y2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002039133A (ja) * | 2000-07-24 | 2002-02-06 | Toyo Kasei Kk | 取付部材の着脱装置 |
JP2008032205A (ja) * | 2006-07-05 | 2008-02-14 | Piolax Inc | クリップ |
US8113756B2 (en) | 2006-07-05 | 2012-02-14 | Piolax Inc. | Clip |
KR101404736B1 (ko) * | 2006-07-05 | 2014-06-09 | 닛산 지도우샤 가부시키가이샤 | 클립 |
WO2012023306A1 (ja) * | 2010-08-16 | 2012-02-23 | 株式会社屋根技術研究所 | 板状モジュールの固定構造 |
JP2012041689A (ja) * | 2010-08-16 | 2012-03-01 | Yane Gijutsu Kenkyusho:Kk | 板状モジュールの固定構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0322569Y2 (en]) | 1991-05-16 |
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