JPS6368506U - - Google Patents

Info

Publication number
JPS6368506U
JPS6368506U JP16230086U JP16230086U JPS6368506U JP S6368506 U JPS6368506 U JP S6368506U JP 16230086 U JP16230086 U JP 16230086U JP 16230086 U JP16230086 U JP 16230086U JP S6368506 U JPS6368506 U JP S6368506U
Authority
JP
Japan
Prior art keywords
flange
legs
pair
twisting force
clip portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16230086U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322569Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16230086U priority Critical patent/JPH0322569Y2/ja
Publication of JPS6368506U publication Critical patent/JPS6368506U/ja
Application granted granted Critical
Publication of JPH0322569Y2 publication Critical patent/JPH0322569Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Insertion Pins And Rivets (AREA)
JP16230086U 1986-10-24 1986-10-24 Expired JPH0322569Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16230086U JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16230086U JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Publications (2)

Publication Number Publication Date
JPS6368506U true JPS6368506U (en]) 1988-05-09
JPH0322569Y2 JPH0322569Y2 (en]) 1991-05-16

Family

ID=31089432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16230086U Expired JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Country Status (1)

Country Link
JP (1) JPH0322569Y2 (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002039133A (ja) * 2000-07-24 2002-02-06 Toyo Kasei Kk 取付部材の着脱装置
JP2008032205A (ja) * 2006-07-05 2008-02-14 Piolax Inc クリップ
WO2012023306A1 (ja) * 2010-08-16 2012-02-23 株式会社屋根技術研究所 板状モジュールの固定構造

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7211508B2 (en) 2003-06-18 2007-05-01 Applied Materials, Inc. Atomic layer deposition of tantalum based barrier materials

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002039133A (ja) * 2000-07-24 2002-02-06 Toyo Kasei Kk 取付部材の着脱装置
JP2008032205A (ja) * 2006-07-05 2008-02-14 Piolax Inc クリップ
US8113756B2 (en) 2006-07-05 2012-02-14 Piolax Inc. Clip
KR101404736B1 (ko) * 2006-07-05 2014-06-09 닛산 지도우샤 가부시키가이샤 클립
WO2012023306A1 (ja) * 2010-08-16 2012-02-23 株式会社屋根技術研究所 板状モジュールの固定構造
JP2012041689A (ja) * 2010-08-16 2012-03-01 Yane Gijutsu Kenkyusho:Kk 板状モジュールの固定構造

Also Published As

Publication number Publication date
JPH0322569Y2 (en]) 1991-05-16

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